- | Chip: | 01005+ |
- | Connector: | Connector: Pitch 0.2mm+ |
- | IC: Lead | Pitch 0.2mm+ |
- | BGA: | Ball Pitch 0.2mm+ |
Material | Coverlay | AD TH min 15 μm |
Double side CCL | Cu TH min 1/4 oz | |
Non-halogens Coverlay | AD TH min 15 μm | |
Non-halogens D/S CCL | Cu TH min 1/4 oz | |
Stiffener board | FR4 | |
Aluminum Alloy | ||
Stainless Steel board | ||
Stiffener film | PI type | PI 2~ 9 mil |
AD 25 ~ 50μm | ||
PET type | PET 3~ 10mil | |
AD 25 ~ 50μm | ||
Thermo sensitive adhesive | Heat-cured | 25 、35 、50μm |
Pressure sensitive adhesive | Pressure sensitive | 50 ~130μm |
D/S Patterning | Pattern | Pitch = 100μm |
Partial Pattern | Pitch = 80μm | |
Guide Hole Size | Guide Hole Size | ∮ 0.15 mm |
∮ 0.1 mm | ||
∮ 0.075 mm | ||
PTH | Thickness of Copper Plating | 15 ± 5 μm |
10 ± 3 μm | ||
7.5±2.5μm | ||
Heat-cured | Min Thickness | Min = 10μm |
Min Hole Diameter | Min = 1.0mm | |
Max Deviation | Max = ± 0.2mm | |
Photo sensitive | Min Thickness | Min = 15μm |
Min Hole Diameter | Min = 0.1mm | |
Max Deviation | Max = ± 0.07mm | |
Sn/Cu Plating | Thickness | 1 ~ 20 μm |
Ni/Au Plating | Thickness | Ni = 1~ 6 μm |
Flash Au/General | Au = 0.03 ~ 0.09μm / 0.2 ~ 0.9μm | |
Immersion Ni/Au | Thickness | Ni = 2 ~6 μm |
Au = 0.03 ~ 0.09 μm |
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